LED solid crystal, and a conductive connection to other electronic materials.

☉ Low thermal resistance / high thermal conductivity

Proper use of silver particles and polymer resin formulations stack, to achieve high thermal conductivity and low resistivity targets.

☉ Thrust and tensile strength

High shear strength and bond strength.

☉ Curing conditions can be recipe adjustment

May, upon customized requirements, adjust formula, in line with the client process required curing temperature and time.